Temperature cycling analysis for ball grid array package using finite element analysis

Purpose – The purpose of this paper is to discuss the capability of finite element analysis (FEA) in performing the virtual thermal cycling reliability test to evaluate the reliability of solder joints in a ball grid array (BGA) package.Design/methodology/approach – Thermal cycling test has been used to evaluate the reliability or fatigue life of the solder joints in BGA package using commercially available FEA software, ANSYS™. The effect of different temperature cycling condition is studied by applying different value of dwell time and ramp rate. Two types of analyses are used namely, the physics‐based analysis and the statistical‐based analysis. Two screening design methods namely, central composite design (CCD) and Box‐Behnken Matrix Design method are used to isolate the most important factors amongst six selected design variables. The optimization process is carried out using response surface methodology (RSM).Findings – It is observed that changes in ramp rate produce significant effect in solder fa...

[1]  Guna S Selvaduray,et al.  Solder joint fatigue models: review and applicability to chip scale packages , 2000 .

[2]  B. A. Zahn.  Impact of ball via configurations on solder joint reliability in tape-based, chip-scale packages , 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

[3]  J. Van de Peer,et al.  Probabilistic design approach for package design and solder joint reliability optimization for a lead free BGA package , 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

[4]  Sidharth,et al.  Board level solder reliability vs. ramp rate & dwell time during temperature cycling , 2003, 2003 IEEE International Reliability Physics Symposium Proceedings, 2003. 41st Annual..

[5]  Robert Darveaux,et al.  Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction , 2002 .

[6]  G. Q. Zhang,et al.  Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach , 2004, Microelectron. Reliab..

[7]  L. Zhang,et al.  Response surface models for efficient, modular estimation of solder joint reliability in area array packages , 2005, Microelectron. Reliab..

[8]  Bart Vandevelde,et al.  Parameterized Modeling of Thermomechanical Reliability for CSP Assemblies , 2003 .

[9]  Stefan Reh,et al.  Probabilistic finite element analysis using ANSYS , 2006 .

[10]  Wei Ren,et al.  A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending , 2004, Microelectron. Reliab..

[11]  Yi-Shao Lai,et al.  Optimal design towards enhancement of board-level thermomechanical reliability of wafer-level chip-scale packages , 2007, Microelectron. Reliab..

[12]  W.D. van Driel,et al.  Design for Reliability of Wafer Level Packages , 2006, EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.

[13]  D. Agonafer,et al.  Design optimization and reliability of PWB level electronic package , 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

[14]  Enrique Del Castillo,et al.  Process Optimization: A Statistical Approach , 2007 .

[15]  L. Anand.  Constitutive equations for hot-working of metals , 1985 .

[16]  R. Darveaux.  Effect of simulation methodology on solder joint crack growth correlation , 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

[17]  Chang-Chun Lee,et al.  Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology , 2007, Microelectron. Reliab..

[18]  Rong-Sheng Chen,et al.  Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder joint , 2008, Microelectron. Reliab..