Laser Processing For Application Specific Integrated Circuits (ASICs)

ASIC devices can be programmed by lasers using two techniques - a photochemical approach to direct-write connections or localized heating of the circuits by a laser spot to cut or form link structures. The technique to cut links is a mature process based on cutting similar link structures used to repair memory devices with redundant circuitry. The link-cutting process described here provides a 90% or higher programming yield on a 100,000 link ASIC based on specific process recommendations including optical verification of link cutting performance.