Evaluation of Fatigue Life Reliability and New Lead Bonding Technology for Power Modules

The authors have developed a fast thermal cycling test method of evaluating the reliability of power modules. The method shortens the time required for a life evaluation test of Al wire bond lift-off to one-quarter of the conventional power cycling test method. The authors have also developed a technology for Cu lead interconnection structures that can be applied for higher current densities of chips and improved productivity, replacing the current Al wiring method.