On the effect of I/sub SSQ/ testing in reducing early failure rate

This paper details results of a year-long study on the effects of I/sub SSQ/ testing on the reduction of early failure rate (EFR) of microcontrollers. This experiment screened a large quantity of ICs at package testing to a preset I/sub SSQ/ limit, performed burn-in on all parts, and investigated the effectiveness of I/sub SSQ/ in removal of infant mortality failures. The ultimate purpose of this study was to determine a suitable I/sub SSQ/ test limit for wafer sort to ensure a high level of outgoing quality and reliability.

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