Transfer Mould Packaging for Sensors
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This paper introduces a novel packaging technology for solid-state sensor chips. For this purpose the inserts of a standard mould plate are equipped with soft (silicone) nipples that during the moulding process gently press over the active sensor areas in order to prevent these areas to be blocked with molding compound. The main advantage of the soft nipples over the previously introduced (soft coated) hard nipples [1] is that no hard tooling to the moulding inserts is required. The nipples on the inserts can be easily build and removed giving a great flexibility in changing from one product to the other. Yet, the nipples are strong enough to survive many moulding shots without visible deterioration.
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