Analytical optimization of high-transmission attenuated phase-shifting reticles

For sub-50-nm semiconductor patterning processes, extremely coherent illumination and high-transmission (Hi-T) attenuated background phase-shifting reticles are becoming increasingly important in delivering high-quality aerial images. Here, a Hi-T reticle is defined as any attenuated phase-shifting mask with a background transmission intensity of 12% or higher of incident light. While numerical simulation has served as a powerful tool in reticle design, the analytical relation of image log slope (ILS) and mask error enhancement factor (MEEF) are calculable in concise, exact form to reveal additional insight into reticle optimization. The properties of ILS and MEEF can be derived analytically in predicting the optimal range of mask bias in terms of image contrast and sensitivity for improved critical dimension (CD) control. These derived relations also demonstrate the capability for analysis beyond extensive numerical simulation and can be easily scaled and applied to various pitches and mask CDs. These relations are also verified in this paper with simulation of realistic process parameters and thus prove the applicability in optimization of Hi-T reticles.

[1]  Christopher A. Spence,et al.  Impact of optical enhancement techniques on the mask error enhancement function (MEEF) , 2000, Advanced Lithography.

[2]  Michael T. Reilly,et al.  Effects of mask bias on the mask error enhancement factor (MEEF) of contact holes , 2001, SPIE Advanced Lithography.

[3]  Alfred K. K. Wong,et al.  The mask error factor in optical lithography , 2000 .

[4]  Yuri Granik,et al.  Using OPC to optimize for image slope and improve process window , 2003, Photomask Japan.

[5]  Wen-an Loong,et al.  Simulations of Mask Error Enhancement Factor in 193 nm Immersion Lithography , 2006 .

[6]  Vincent Wiaux,et al.  Mighty high-T lithography for 65-nm generation contacts , 2003, SPIE Advanced Lithography.

[7]  David Z. Pan,et al.  True process variation aware optical proximity correction with variational lithography modeling and model calibration , 2007 .

[8]  Chun-Kuang Chen,et al.  Customized illumination aperture filter design for through-pitch focus latitude enhancement of deep submicron contact hole printing , 2002 .

[9]  John S. Petersen Analytical description of antiscattering and scattering bar assist features , 2000, Advanced Lithography.

[10]  Franklin M. Schellenberg,et al.  MEEF in theory and practice , 1999, Photomask Technology.

[11]  Ralf Ziebold,et al.  Image degradation due to phase effects in chromeless phase lithography , 2006, SPIE Photomask Technology.

[12]  Yuri Granik,et al.  MEEF as a matrix , 2002, SPIE Photomask Technology.

[13]  Anthony Yen,et al.  Mask error tensor and causality of mask error enhancement for low- k 1 imaging: theory and experiments , 2004 .

[14]  James C. Word,et al.  Lithographic tradeoffs between different assist feature OPC design strategies , 2003, SPIE Advanced Lithography.