论文信息 - Characterization of differential via holes using equivalent circuit extraction technique

Characterization of differential via holes using equivalent circuit extraction technique

A fast and accurate characterization method of differential via holes is presented based on the equivalent circuit extraction technique. A 3-D model of differential via holes is created and simulated using a full wave solver and the results are compared with the equivalent circuit model using Advanced Design System software. Results presented validate the proposed approach. © 2007 Wiley Periodicals, Inc. Int J RF and Microwave CAE, 2007.

Tao V. Nguyen | Aldo W. Morales | Sedig Agili

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