Rapid Interface Reliability Testing of Flip Chip Encapsulants
暂无分享,去创建一个
H. Reichl | K.-F. Becker | B. Wunderle | I. Rau | H. Reichl | B. Wunderle | I. Rău | K. Becker
[1] C.P. Wong,et al. Influence of temperature and humidity on adhesion of underfills for flip chip packaging , 2005, IEEE Transactions on Components and Packaging Technologies.
[2] E. O'brien. Durability of Adhesive Joints Subjected to Environemntal Stress , 2003 .
[3] Jianmin Qu,et al. Moisture absorption in no-flow underfill materials and its effect on interfacial adhesion to solder mask coated FR4 printed wiring board , 2001, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562).
[5] Takeshi Takatoya,et al. Heat and water mass transfer modeling in polyimide based advanced composites , 2000 .
[6] T. B. Lim,et al. Non-Fickian moisture properties characterisation and diffusion modeling for electronic packages , 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).
[7] John Crank,et al. The Mathematics Of Diffusion , 1956 .
[8] Patrick D. T. O'Connor,et al. Testing for Reliability , 2003 .
[9] L. Mascia,et al. Vibrational Spectroscopy Evidence for the Dual Nature of Water Sorbed into Epoxy Resins , 2000 .
[10] H. Reichl,et al. Thermo-mechanical reliability of power flip-chip cooling concepts , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
[11] Jianmin Qu,et al. Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface , 2000, Packaging of Electronic and Photonic Devices.
[12] B. Ellis,et al. The glass transition temperature of an epoxy resin and the effect of absorbed water , 1979 .
[13] C. Sung,et al. Characterization of Interaction of Water in Epoxy by UV Reflection Spectroscopy , 2001 .
[14] B. Michel,et al. Studies on parameters for popcorn cracking , 2001, First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592).
[15] Joaquín López,et al. Effect of water sorption on the structure and mechanical properties of an epoxy resin system , 2001 .
[16] S. Rzepka,et al. The effect of underfill imperfections on the reliability of flip chip modules: FEM simulations and experiments , 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).
[17] M. Williams,et al. Flip chip on board connection technology: process characterization and reliability , 1994 .
[18] Souheng Wu. Polar and Nonpolar Interactions in Adhesion , 1973 .
[19] D. J. Xie,et al. A new experimental method to evaluate creep fatigue life of flip-chip solder joints with underfill , 2000 .
[20] John W. Gillespie,et al. Moisture diffusion in epoxy systems , 1999 .
[21] J. Crank. Mathematical Models in Heat Flow and Diffusion , 1970 .
[22] Chan Eon Park,et al. Humidity effects on adhesion strength between solder ball and epoxy underfills , 1997 .
[23] C. Soles,et al. Contributions of the nanovoid structure to the kinetics of moisture transport in epoxy resins , 2000 .
[24] W. T. Chen,et al. Materials and mechanics issues in flip-chip organic packaging , 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.
[25] C. J. L. Rothkrantz. TESTING FOR RELIABILITY AN APPLIED APPROACH , 2005 .
[26] Xuejun Fan,et al. Investigation of the underfill delamination and cracking in flip-chip modules under temperature cyclic loading , 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).