Measurement of the Young's modulus of moulding compounds at elevated temperatures with a resonance method
暂无分享,去创建一个
[1] I. Fukuzawa,et al. Moisture Resistance Degradation of Plastic LSIs by Reflow Soldering , 1985, 23rd International Reliability Physics Symposium.
[2] Rainer Dudek,et al. A simple model for the Mode I popcorn effect for IC packages with copper leadframe , 2002 .
[3] B. Michel,et al. Studies on parameters for popcorn cracking , 2001, First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592).
[4] Milton Ohring,et al. Reliability and Failure of Electronic Materials and Devices, Second Edition , 1998 .
[5] A. Wolfenden,et al. Impulse excitation technique for dynamic flexural measurements at moderate temperature , 1988 .
[6] F. Taheri,et al. A nondestructive method for evaluating natural frequency of glued-laminated beams reinforced with GRP , 2003 .
[7] Wann,et al. Dynamic Young ' s Modulus Measurements in Metallic Materials : Results of an Interlaboratory Testing Program , 2003 .
[8] Rainer Tilgner,et al. Young's modulus of moulding compounds measured with a resonance method , 2005 .
[9] John S. Popovics,et al. Determining elastic properties of concrete using vibrational resonance frequencies of standard test cylinders , 2000 .
[10] Rainer Dudek,et al. On the mode II popcorn effect in thin packages , 2002 .
[11] E. Case,et al. Elastic modulus determination of coating layers as applied to layered ceramic composites , 1991 .
[12] P. Lambrechts,et al. Determination of Young's modulus of dental composites: A phenomenological model , 1987 .