New 3D TLM condensed node structures for improved simulation of conductor strips
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The authors present a set of modified condensed node TLM (transmission line matrix) structures, compatible with the 3D TLM condensed node, that improve the modeling of conductor strips and provide a means of directly embedding lumped devices into the mesh. The improvement in accuracy is demonstrated by evaluating the propagation constant of a simulated microstrip line.<<ETX>>
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