Silicon-to-silicon anodic bonding with a borosilicate glass layer

Anodic bonding of silicon wafers by sputter deposited glass films, silicon-to-silicon anodic bonding, is presented as a promising sealing method in microengineering. A reliable process for wafer-to-wafer bonding is described and data concerning yield and bonding strength are given. Cathodic bonding is reported in a discussion about the bonding mechanism. Different sputter deposited and annealed Pyrex 7740 layers are evaluated as sealing material. Some advantages of silicon-to-silicon anodic bonding as a mounting method for micromechanical sensors are quantified.

[1]  J. Lasky.  Wafer bonding for silicon‐on‐insulator technologies , 1986 .

[2]  George Wallis.  Field Assisted Glass Sealing , 1975 .

[3]  Integral glass sheet encapsulation for terrestrial panel applications. [solar cell modules , 1976 .

[4]  S. Bengtsson,et al.  Interface Charge Control Of Directly Bonded Silicon Structures , 1989 .

[5]  W. Ko,et al.  Development of a miniature pressure transducer for biomedical applications , 1979, IEEE Transactions on Electron Devices.

[6]  A. Hanneborg.  Silicon wafer bonding techniques for assembly of micromechanical elements , 1991, [1991] Proceedings. IEEE Micro Electro Mechanical Systems.

[7]  T. R. Anthony.  Anodic bonding of imperfect surfaces , 1983 .

[8]  Yozo Kanda,et al.  The mechanism of field-assisted silicon-glass Bonding , 1990 .

[9]  M. Borom.  Electron‐Microprobe Study of Field‐Assisted Bonding of Glasses to Metals , 1973 .

[10]  K. Albaugh,et al.  Mechanisms of anodic bonding of silicon to pyrex glass , 1988, IEEE Technical Digest on Solid-State Sensor and Actuator Workshop.

[11]  A. D. Brooks,et al.  Low‐Temperature Electrostatic Silicon‐to‐Silicon Seals Using Sputtered Borosilicate Glass , 1972 .

[12]  G. Wallis,et al.  Direct‐Current Polarization During Field‐Assisted Glass‐Metal Sealing , 1970 .

[13]  Kurt E. Petersen,et al.  Ultra-stable, high-temperature pressure sensors using silicon fusion bonding , 1990 .

[14]  Heinz-Gerd Graf,et al.  Wafer bonding: Investigation and in situ observation of the bond process , 1990 .

[15]  Phillip W. Barth,et al.  Silicon fusion bonding for fabrication of sensors, actuators and microstructures , 1990 .

[16]  A. Hanneborg,et al.  An integrated capacitive pressure sensor with frequency-modulated output , 1986 .

[17]  W. Maszara,et al.  Bonding of silicon wafers for silicon‐on‐insulator , 1988 .

[18]  G. Wallis,et al.  Field Assisted Glass‐Metal Sealing , 1969 .

[19]  Richard S. Muller,et al.  Fusing silicon wafers with low melting temperature glass , 1990 .

[20]  Per Ohlckers,et al.  A capacitive silicon pressure sensor with low TCO and high long-term stability , 1990 .