Determining thermal and mechanical properties of polyimide using the DIC method

Polyimide (PI) is widely used in the aerospace and microelectronics industry and engineering due to its excellent electric and mechanical properties; however, the high thermal expansion of the PI causes the problem on the thermal expansion mismatching. A new type of PI with P-Phenylene diamine as diamine monomer is proposed to reduce the thermal expansion. The coefficient of thermal expansion (CTE) and the Young's module of this PI films are studied in this paper using DIC method. The CTE of the new type PI films is about 21x10-6/°C, which is greatly reduced. The successful results demonstrated the feasibility of DIC method to measure the thermal and mechanical properties of films.

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