Super-Wideband SSN Suppression in High-Speed Digital Communication Systems by Using Multi-Via Electromagnetic Bandgap Structures

With the advance of semiconductor manufacturing, EDA, and VLSI design technologies, circuits with even higher speed are integrated at an even higher density. Simultaneous switching noise (SSN) severely affects the performance of ICs and communication systems. In this paper, a novel multi-via electromagnetic bandgap (MV-EBG) structure is proposed with super-wideband SSN suppression. The stopband of the proposed MV-EBG structure is much wider than the traditional one, about 2 to 6 times. Little extra cost is added since there is no more change than the numbers of the vias. Further, a novel MV-EBG structure that formed by merging one-via EBG structures into different shape is proposed. Like the MV-EBG structures, Merged EBG structures also exhibit a wideband characteristic. The excellent SSN suppression of the MV-EBG and merged EBG structures are verified by simulations and measurements. Good performances are observed.