Preparation and properties of glass cloth‐reinforced polyimide composites with improved impact toughness for microelectronics packaging substrates

A series of glass cloth-reinforced thermosetting polyimide composites (EG/HTPI) were prepared from E-glass cloth (EG) and polyimide matrix resins. The polyimide resins were derived from 1,4-bis(4-amino-2- trifluoromethyl-phenoxy)benzene, p-phenylenediamine, diethyl ester of 3,3′,4,4′-benzophenonetetracarboxylic acid, and monoethyl ester of cis-5-norbornene-endo-2,3-dicarboxylic acid. Based on the rheological properties of the B-staged polyimide resins, the optimized molding cycles were designed to fabricate the EG/HTPI laminates and the copper-clad laminates (Cu/EG/HTPI). Experimental results indicated that the EG/HTPI composites exhibited high thermal stability and outstanding mechanical properties. They had flexural strength of >534 MPa, flexural modulus of >20.0 GPa, and impact toughness of >46.9 kJ/m2. The EG/HTPI composites also showed good electrical and dielectric properties. Moreover, the EG/HTPI laminates exhibited peel strength of ∼ 1.2 N/mm and great isothermal stability at 288°C for 60 min, showing good potential for application in high density packaging substrates. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010

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