Laser direct-write and its application in low temperature Co-fired ceramic (LTCC) technology
暂无分享,去创建一个
Scott A. Mathews | Barry K. Gilbert | Douglas B. Chrisey | Chengping Zhang | Timothy M. Schaefer | H. D. Wu | Rohit Modi | David Liu | John Graves
[1] A. N. Jette,et al. Metal deposition at 532 nm using a laser transfer technique , 1988 .
[2] Anthony J. Pedraza,et al. New approach of a laser-induced forward transfer for deposition of patterned thin metal films , 1995 .
[3] H. D. Wu,et al. Direct writing of conformal mesoscopic electronic devices by MAPLE DW , 2000 .
[4] Scott A. Mathews,et al. Integrated tool for fabrication of electronic components by laser direct write , 2002, SPIE LASE.
[5] Jie Zhang,et al. Fine-line conductor manufacturing using drop-on demand PZT printing technology , 2002 .
[6] R. A. McGill,et al. A novel laser transfer process for direct writing of electronic and sensor materials , 1999 .
[7] Randall W. Rhea. HF filter design and computer simulation , 1994 .
[8] F. J. Adrian,et al. Metal deposition from a supported metal film using an excimer laser , 1986 .
[9] V. Lantto,et al. Planar inductors on an LTCC substrate realized by the gravure-offset-printing technique , 2000 .
[10] Peter Barnwell,et al. Thick film fine line patterning: A definitive discussion of the alternatives , 2001 .
[11] Alberto Piqué,et al. Direct-write technologies for rapid prototyping applications : sensors, electronics and integrated power sources , 2002 .
[12] C. Harper. Electronic Materials and Processes Handbook , 1993 .
[13] Markku Lahti,et al. Passive RF band-pass filters in an LTCC module made by fine-line thick-film pastes , 2001 .