Real time dielectric investigations of phase separation and cure in rubber modified epoxy resin systems

[1]  G. P. Johari,et al.  Relaxations of thermosets. III. Sub‐Tg dielectric relaxations of bisphenol‐A–based epoxide cured with different cross‐linking agents , 1990 .

[2]  D. Kranbuehl,et al.  Monitoring the cure processing properties of unsaturated polyesters in situ during fabrication , 1989 .

[3]  S. Senturia,et al.  Dielectric properties of bisphenol‐a epoxy resins , 1989 .

[4]  S. Delos,et al.  Use of the frequency dependence of the impedance to monitor viscosity during cure , 1989 .

[5]  C. Bucknall,et al.  Toughening tetrafunctional epoxy resins using polyetherimide , 1989 .

[6]  A. Yee,et al.  Toughening mechanisms in elastomer-modified epoxies , 1986 .

[7]  A. Yee,et al.  Toughening mechanisms in elastomer-modified epoxies , 1986 .

[8]  W. Winfree,et al.  Dynamic dielectric analysis: Nondestructive material evaluation and cure cycle monitoring , 1986 .

[9]  J. Seferis,et al.  Dielectric modeling of the curing process , 1986 .

[10]  S. Senturia,et al.  Chemical interpretation of the relaxed permittivity during epoxy resin cure , 1986 .

[11]  D. Day Effects of stoichiometric mixing ratio on epoxy cure ― a dielectric analysis , 1986 .

[12]  D Hayward,et al.  Low-frequency dielectric measurements (10-4 to 6 × 104 Hz): a new computer-controlled method , 1984 .

[13]  R. Pethrick,et al.  Rubber-modified epoxy resins: 3. Influence of filler on the dielectric relaxation properties , 1982 .

[14]  Alexander D. Wilson,et al.  Dielectric properties of phase separated polymer solids: 1. Styrene-butadiene-styrene triblock copolymers , 1978 .

[15]  L. Broutman,et al.  Micromechanics Studies of Rubber-reinforced Glassy Polymers , 1971 .

[16]  D. Kaelble Dynamic and tensile properties of epoxy resins , 1965 .

[17]  Richard A. Pethrick,et al.  Real time dielectric measurements of network formation in a crosslinked epoxy resin system , 1991 .

[18]  Y. Mai,et al.  Failure mechanisms in toughened epoxy resins—A review , 1988 .

[19]  Norman F. Sheppard,et al.  Dielectric Analysis of Thermoset Cure. , 1986 .

[20]  R. Pethrick,et al.  Rubber-modified epoxy resins: 1. Equilibrium physical properties , 1981 .

[21]  R. Pethrick,et al.  Rubber-modified epoxy resins: 2. Dielectric and ultrasonic relaxation studies , 1981 .

[22]  C. A. May,et al.  Epoxy Resins: Chemistry and Technology , 1973 .

[23]  F. Mcgarry,et al.  Effect of rubber particle size on deformation mechanisms in glassy epoxy , 1973 .