Wireless TestStructure forIntegrated Systems

Contact-based wafer testing ofcomplex integrated systems presents several drawbacks: inherent limitations interms ofpadpitch reduction andnumberofdevices tested in parallel, eventual "touchdown" damagetothechip when recursive test isrequired. This paperpresents asolution basedona wireless communication between thetest equipment andthedevice under test. TOPICS: System-in-Package Test, Wireless Wafer Testing