Modelling and characterisation of smart power devices

This paper deals with the system design, technology and test of a novel concept of integrating Si and SiC power dies along with thermo-electric coolers in order to thermally manage transients occurring during operation, thus turning it into a smart power device. The concept features double-sided cooling as well as new materials and joining technologies to integrate the dies such as transient liquid phase bonding/soldering. Coupled-field simulations are used to predict thermal performance and are verified by especially designed test stands to very good agreement. This paper is the first in a series of planned publications on the ongoing work in the project.

[1]  Klaus-Dieter Lang,et al.  Transient Liquid Phase Soldering for lead-free joining of power electronic modules in high temperature applications , 2012 .

[2]  D. Koester,et al.  Hot spot cooling using embedded thermoelectric coolers , 2006, Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium.

[3]  T. Harman,et al.  Measurement of Thermal Conductivity by Utilization of the Peltier Effect , 1959 .

[4]  Bernhard Wunderle,et al.  Lifetime modelling for microsystems integration: from nano to systems , 2009 .

[5]  T. Stockmeier,et al.  From Packaging to "Un"-Packaging - Trends in Power Semiconductor Modules , 2008, 2008 20th International Symposium on Power Semiconductor Devices and IC's.

[6]  H. Reichl,et al.  Advances in thermal interface technology: mono-metal interconnect formation, processing and characterisation , 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

[7]  Carl D. Sorensen,et al.  Overview of transient liquid phase and partial transient liquid phase bonding , 2011, Journal of Materials Science.

[8]  E. E. Antonova,et al.  Finite elements for thermoelectric device analysis in ANSYS , 2005, ICT 2005. 24th International Conference on Thermoelectrics, 2005..

[9]  Peng Wang,et al.  On-chip Hot Spot Remediation with Miniaturized Thermoelectric Coolers , 2009 .

[10]  Dirk Siepe,et al.  New assembly and interconnects beyond sintering methods , 2010 .

[11]  Bernhard Wunderle,et al.  Nanoporous interconnects , 2010, 3rd Electronics System Integration Technology Conference ESTC.

[12]  Juergen Schulz-Harder.  Review on Highly Integrated Solutions for Power Electronic Devices , 2008 .

[13]  Uwe Scheuermann,et al.  Reliability challenges of automotive power electronics , 2009, Microelectron. Reliab..

[14]  M. Asheghi,et al.  Effect of thermal cycling on commercial thermoelectric modules , 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

[15]  Martin Jaegle.  Simulating Thermoelectric Effects with Finite Element Analysis using COMSOL , 2007 .

[16]  Martin Schneider-Ramelow,et al.  Technologies and Trends to Improve Power Electronic Packaging , 2011 .

[17]  Klaus-Dieter Lang,et al.  Interface degradation of Al heavy wire bonds on power semiconductors during active power cycling measured by the shear test , 2010, 2010 6th International Conference on Integrated Power Electronics Systems.

[18]  M. Schneider-Ramelow,et al.  Design and assembly of power semiconductors with double-sided water cooling , 2008 .

[19]  Hwa-Teng Lee,et al.  Influence of interfacial intermetallic compound on fracture behavior of solder joints , 2003 .