Automatic calibration of detailed IC package models

Structure function based simulation model calibration has become common in the electronics cooling industry. Verifying that a model can produce a simulated structure function curve that matches an experimental structure function is valuable to the analyst, as it confirms the simulation model will respond correctly to any power stimulus for a particular application. Structure function based model calibration has typically been a manual process and required a high level of domain knowledge to be successful. The present work introduces a method to reduce structure function based calibration into an optimization problem and discusses the associated work flow.

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