Majority of engineered wood product such as glulam, laminated veneer lumber and parallel strand lumber relies greatly on wood adhesive bonding and adhesive penetration. Determination of bonding strength and adhesive penetration of adhesive-wood could enhance effective utilization of wood as construction material. Kapur (Dryobalanops aromatica) and Kelat (Syzygium spp.) were two commercial Malaysian medium hardwoods were used in the study. Since pressure is essential during wood bonding, the purpose of the study is to determine the effect of different pressure on bonding strength and adhesive penetration. Kapur and Kelat samples were bonded using Phenol resorcinol formaldehyde (PRF) and press at three different pressures (100 psi, 200 psi and 300 psi). Shear stress of bond line and Adhesive penetration were measured. The result shows that Kapur has lower bonding strength compares to Kelat and both samples pressed with 200 psi pressure shows higher shear strength then 100 psi and 300 psi. The result of adhesive penetration shows that higher pressure applied during bonding assembly resulting in the higher adhesive penetration into the wood porous structure.
[1]
F. Carlo,et al.
Comparative analysis of a wood: adhesive bondline
,
2011,
Wood Science and Technology.
[2]
Robert J. Ross,et al.
Wood handbook : wood as an engineering material
,
2010
.
[3]
Christopher G. Hunt,et al.
Adhesives with wood materials : bond formation and performance
,
2010
.
[4]
F. Kamke,et al.
ADHESIVE PENETRATION IN WOOD—A REVIEW
,
2007
.
[5]
F. Kamke,et al.
Penetration of Liquid Urea-Formaldehyde Adhesive into Beech Wood
,
2007
.
[6]
C. Frihart.
Adhesive Bonding and Performance Testing of Bonded Wood Products
,
2005
.
[7]
Ulrich Müller,et al.
Direct measurement of strain distribution along a wood bond line. Part 2: Effects of adhesive penetration on strain distribution
,
2005
.
[8]
Roger M. Rowell,et al.
Handbook of wood chemistry and wood composites.
,
2005
.
[9]
C. Frihart,et al.
Examination of adhesive penetration in modified wood using fluorescence microscopy
,
2005
.