Board Interconnections Test Model Based on Boundary Scan

The paper optimizes the board interconnections model and test methodology based on boundary scan.Based on the investigations into board manufacturing defects,a new defect model is proposed for boundary scan interconnections test.The new model takes into accounting the situation that the input and output of one net have different defects.The test solution for the new model is also provided.By implementing the right test solution for this model,manufacturing test can cover more potential defects.The efficiency for factory test and repairment are improved.