Development of a High Density, Planar, Modular Microfluidic Interconnect System

The development of a high density, planar, modular microfluidic interconnect system is described that is based upon the application of conventional gasket sealing principles to miniaturized bulk micromachined geometries in silicon. Microfluidic ports between two flat surfaces are sealed by an intervening micromolded elastomeric gasket that mates to micromachined bosses around each port. The gasket seal construction allows for precise control of the sealing pressure and for insuring its uniform distribution around each port. The interconnect system does not utilize any external fitting hardware and can achieve high density microfluidic interconnects with port-to-port pitches as small as 2 mm.