High power dpss laser micromachining of silicon, tungsten and stainless steel for device singulation

We describe recent high power diode-pumped solid-state (DPSS) and copper-vapour (CVL) laser micromachining results of commonly used industrial materials such as silicon, tungsten and stainless steel. Frequency upconverted lasers were used at 532nm and 355nm as well as the copper laser (511nm). We discuss the benefits of high laser intensity (∼ GW/cm2) micromachining for efficient laser microfabrication. At such high irradiance conditions material properties are approaching their critical limits and ablation mechanisms are complex. These can be exploited to our advantage in particular for microdrilling and microcutting small feature sizes in the order 10-20 µm and high aspect ratios of up to 20:1. Etch rate data are presented and a comparative study of the ablation efficiency in these materials is discussed. The potential applications of this technology to device singulation for electronic and power generation devices will be described.We describe recent high power diode-pumped solid-state (DPSS) and copper-vapour (CVL) laser micromachining results of commonly used industrial materials such as silicon, tungsten and stainless steel. Frequency upconverted lasers were used at 532nm and 355nm as well as the copper laser (511nm). We discuss the benefits of high laser intensity (∼ GW/cm2) micromachining for efficient laser microfabrication. At such high irradiance conditions material properties are approaching their critical limits and ablation mechanisms are complex. These can be exploited to our advantage in particular for microdrilling and microcutting small feature sizes in the order 10-20 µm and high aspect ratios of up to 20:1. Etch rate data are presented and a comparative study of the ablation efficiency in these materials is discussed. The potential applications of this technology to device singulation for electronic and power generation devices will be described.