Design and Fabrication of Full Board Direct Liquid Cooling Heat Sink for Densely Packed FPGA Processing Boards
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Johan Pragt | Gijs Schoonderbeek | Sjouke Kuindersma | Menno Schuil | Grant Hampson | Paulina Fusiara | Leon Hiemstra
[1] V. I. Zaitsev,et al. Warpage of printed-circuit boards due to structural defects in glass-textolites , 1991 .
[2] Loong,et al. Pushing the limits of liquid cooling : Design and analysis of a direct liquid cooling system for power modules , 2012 .
[3] Tolga Acikalin,et al. Direct liquid cooling of bare die packages using a microchannel cold plate , 2014, Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
[4] Thomas E. Sarvey,et al. Monolithic Integration of a Micropin-Fin Heat Sink in a 28-nm FPGA , 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[5] T. C. Chai,et al. Thermal design and analysis of through silicon interposer (TSI) package , 2017, 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).
[6] A. N S V. Sarveswara Sarma,et al. Cooling solution for computing and storage server , 2017, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
[7] G. A. Hampson,et al. Gemini FPGA hardware platform for the SKA low correlator and beamformer , 2017, 2017 XXXIInd General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS).
[8] Sami Alkharabsheh,et al. Pressure drop analysis of direct liquid cooled (DLC) rack , 2017, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
[9] Arpad Szomoru,et al. The application of UniBoard as a beam former for APERTIF , 2014 .
[10] Domhnaill Hernon. Enhanced energy efficiency and reliability of telecommunication equipment with the introduction of novel air cooled thermal architectures , 2010 .
[11] S. Krishnan,et al. Design of Complex Structured Monolithic Heat Sinks for Enhanced Air Cooling , 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[12] Girish Deshpande,et al. Microchannels for thermal management in FPGAs , 2017, 2017 International Conference on ReConFigurable Computing and FPGAs (ReConFig).
[13] A. Koşar,et al. TCPT-2006-096.R2: Micro Scale pin fin Heat Sinks —Parametric Performance Evaluation Study , 2007, IEEE Transactions on Components and Packaging Technologies.
[14] Seppo J. Ovaska,et al. Impact of retrofitted CPU water cooling on supercomputer performance and power consumption , 2016, SoutheastCon 2016.
[15] Christian Plessl,et al. Eight ways to put your FPGA on fire — A systematic study of heat generators , 2012, 2012 International Conference on Reconfigurable Computing and FPGAs.
[16] Bahgat Sammakia,et al. Experimental investigation of direct liquid cooling of a two-die package , 2018, 2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM).
[17] Yang Zhang,et al. Embedded cooling technologies for densely integrated electronic systems , 2015, 2015 IEEE Custom Integrated Circuits Conference (CICC).
[18] Muhannad S. Bakir,et al. Thermal and electrical effects of staggered micropin-fin dimensions for cooling of 3D microsystems , 2014, Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
[19] Domhnaill Hernon. Experimental investigation into honeycomb heat sinks incorporating varying size slots for enhanced heat transfer , 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
[20] Peter Hopton,et al. Enclosed liquid natural convection as a means of transferring heat from microelectronics to cold plates , 2013, 29th IEEE Semiconductor Thermal Measurement and Management Symposium.