Integrated EMI/thermal design for switching power supplies

In this paper, the EMI and thermal performance of power supplies are taken into consideration in the board layout stage of the design cycle. The approach is based on using existing simulation tools, including parameter extracting software, a circuit simulation tool, and thermal analysis software. A power factor correcting circuit was used for the investigation. Examples are given for performance trade-offs for different circuit board layouts and different inductor winding schemes.

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