Effect of Loading Type on Fatigue Lifetime of Sintered-Silver Die Attach
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T. Terasaki | T. Morita | Y. Yasuda | M. Nishimura | Tomohisa Suzuki | H. Nakako | D. Ishikawa | Yuki Kawana | Kazuhiko Kurafuchi
[1] K. Suganuma,et al. Mechanical Deformation of Sintered Porous Ag Die Attach at High Temperature and Its Size Effect for Wide-Bandgap Power Device Design , 2017, Journal of Electronic Materials.
[2] Y. Kariya,et al. Low-Cycle Fatigue Life and Fatigue Crack Propagation of Sintered Ag Nanoparticles , 2017, Journal of Electronic Materials.
[3] T. Terasaki,et al. Thermal cycling lifetime estimation of sintered metal die attachment , 2016, 2016 International Conference on Electronics Packaging (ICEP).
[4] Martin März,et al. Full SiC DCDC-Converter with a Power Density of more than 100kW/dm3 , 2015 .
[5] Denis Bertheau,et al. Influence of the Porous Microstructure on the Elastic Properties of Sintered Ag Paste as Replacement Material for Die Attachment , 2015, Journal of Electronic Materials.
[6] Denis Bertheau,et al. Mechanical Properties of Sintered Ag as a New Material for Die Bonding: Influence of the Density , 2014, Journal of Electronic Materials.
[7] K. Sugiura,et al. 6-in-1 Silicon carbide power module for high performance of power electronics systems , 2014, 2014 IEEE 26th International Symposium on Power Semiconductor Devices & IC's (ISPSD).
[8] Yoshiharu Kariya,et al. Mechanical Behavior of Sintered Nano-sized Ag Particles (Mate2013特集号 : 「エレクトロニクスにおけるマイクロ接合・実装技術」シンポジウム) , 2013 .
[9] Andreas Fix,et al. Failure mechanisms of sintered silver interconnections for power electronic applications , 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.
[10] Guo-Quan Lu,et al. Isothermal low cycle fatigue behavior of nano-silver sintered single lap shear joint , 2012, 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging.
[11] Xu Chen,et al. Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment , 2009 .
[12] Akio Hirose,et al. Bonding Technique Using Micro-Scaled Silver-Oxide Particles for In-Situ Formation of Silver Nanoparticles , 2008 .
[13] Xu Chen,et al. Tensile Behaviors and Ratcheting Effects of Partially Sintered Chip-Attachment Films of a Nanoscale Silver Paste , 2008 .
[14] Guo-Quan Lu,et al. Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material , 2006, IEEE Transactions on Components and Packaging Technologies.
[15] A. Hirose,et al. Influence of Bonding Condition on Bonding Process Using Ag Metallo-Organic Nanoparticles for High Temperature Lead-Free Packaging , 2006 .
[16] J. Groza,et al. Nanoparticulate materials densification , 1996 .
[17] R. A. Bayles,et al. Small particle melting of pure metals , 1986 .
[18] Mieko Takagi,et al. Electron-Diffraction Study of Liquid-Solid Transition of Thin Metal Films , 1954 .