Design and simulation of micro-platform for MEMS devices applied in shock environment

This paper proposes a conceptually simple Si-based shock-protection micro-platform to be integrated with MEMS devices. The micro-platform is able to generate a mitigated shock condition under impact via beam structures and air damping. This paper provides calculations of kinematic and mechanical parameters of the system, including stiffness coefficient and squeeze film damping coefficient, to offer some design guidelines. Some simulations have also been done to test its performance and it shows an approximately 34% attenuation under a 10000g shock.

[1]  J. Judy,et al.  Dynamic response and shock resistance of ferromagnetic micromechanical magnetometers , 2002, Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.02CH37266).

[2]  Minhang Bao,et al.  Squeeze film air damping in MEMS , 2007 .

[3]  Shawn J. Cunningham,et al.  Microstructures designed for shock robustness , 1996, Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components.

[4]  M. Macaulay,et al.  Introduction to impact engineering , 1987 .

[5]  L. B. Wilner A high performance variable capacitance accelerometer , 1988, 1988. IMTC-88. 5th IEEE Instrumentation and Measurement Technology Conference.

[6]  G. Kovacs,et al.  Bulk micromachining of silicon , 1998, Proc. IEEE.

[7]  Jeremy A. Walraven,et al.  MEMS reliability in shock environments , 2000, 2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No.00CH37059).

[8]  Lee Ho,et al.  Effects of squeezed film damping on dynamic finite element analyses of MEMS , 2001, Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS.