A 14 nm 1.1 Mb Embedded DRAM Macro With 1 ns Access

A 1.1 Mb embedded DRAM macro (eDRAM), for next-generation IBM SOI processors, employs 14 nm FinFET logic technology with 0.0174 μm2 deep-trench capacitor cell. A Gated-feedback sense amplifier enables a high voltage gain of a power-gated inverter at mid-level input voltage, while supporting 66 cells per local bit-line. A dynamic-and-gate-thin-oxide word-line driver that tracks standard logic process variation improves the eDRAM array performance with reduced area. The 1.1 Mb macro composed of 8 ×2 72 Kb subarrays is organized with a center interface block architecture, allowing 1 ns access latency and 1 ns bank interleaving operation using two banks, each having 2 ns random access cycle. 5 GHz operation has been demonstrated in a system prototype, which includes 6 instances of 1.1 Mb eDRAM macros, integrated with an array-built-in-self-test engine, phase-locked loop (PLL), and word-line high and word-line low voltage generators. The advantage of the 14 nm FinFET array over the 22 nm array was confirmed using direct tester control of the 1.1 Mb eDRAM macros integrated in 16 Mb inline monitor.

[1]  Taejoong Song,et al.  13.2 A 14nm FinFET 128Mb 6T SRAM with VMIN-enhancement techniques for low-power applications , 2014, 2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC).

[2]  Dave Johnson,et al.  4.8 A 28nm x86 APU optimized for power and area efficiency , 2015, 2015 IEEE International Solid-State Circuits Conference - (ISSCC) Digest of Technical Papers.

[3]  James P. Norum,et al.  0.026µm2 high performance Embedded DRAM in 22nm technology for server and SOC applications , 2014, 2014 IEEE International Electron Devices Meeting.

[4]  E.J. Nowak,et al.  Turning silicon on its edge [double gate CMOS/FinFET technology] , 2004, IEEE Circuits and Devices Magazine.

[5]  Christopher Gonzalez,et al.  5.1 POWER8TM: A 12-core server-class processor in 22nm SOI with 7.6Tb/s off-chip bandwidth , 2014, 2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC).

[6]  Balaram Sinharoy,et al.  POWER7: IBM's next generation server processor , 2010, 2009 IEEE Hot Chips 21 Symposium (HCS).

[7]  Erik Nelson,et al.  A 45 nm SOI Embedded DRAM Macro for the POWER™ Processor 32 MByte On-Chip L3 Cache , 2011, IEEE Journal of Solid-State Circuits.

[8]  S. Narasimha,et al.  22nm High-performance SOI technology featuring dual-embedded stressors, Epi-Plate High-K deep-trench embedded DRAM and self-aligned Via 15LM BEOL , 2012, 2012 International Electron Devices Meeting.

[9]  T. Kirihata,et al.  A 0.039um2 high performance eDRAM cell based on 32nm High-K/Metal SOI technology , 2010, 2010 International Electron Devices Meeting.

[10]  Victor V. Zyuban,et al.  IBM POWER7+ design for higher frequency at fixed power , 2013, IBM J. Res. Dev..

[11]  Balaram Sinharoy,et al.  POWER7™, a Highly Parallel, Scalable Multi-Core High End Server Processor , 2011, IEEE Journal of Solid-State Circuits.

[12]  Swaroop Ghosh,et al.  A 1 Gb 2 GHz 128 GB/s Bandwidth Embedded DRAM in 22 nm Tri-Gate CMOS Technology , 2015, IEEE Journal of Solid-State Circuits.

[13]  G. Northrop,et al.  High performance 14nm SOI FinFET CMOS technology with 0.0174µm2 embedded DRAM and 15 levels of Cu metallization , 2014, 2014 IEEE International Electron Devices Meeting.

[14]  Toshiaki Kirihata High Performance Embedded Dynamic Random Access Memory in Nano-Scale Technologies , 2010 .

[15]  John E. Barth,et al.  Embedded DRAM: Technology platform for the Blue Gene/L chip , 2005, IBM J. Res. Dev..

[16]  William J. Bowhill,et al.  The Xeon® Processor E5-2600 v3: a 22 nm 18-Core Product Family , 2016, IEEE Journal of Solid-State Circuits.

[17]  Robert M. Averill,et al.  A 5.2GHz microprocessor chip for the IBM zEnterprise™ system , 2011, 2011 IEEE International Solid-State Circuits Conference.