Central composite designs coupled with simulation techniques for optimizing RIE process
暂无分享,去创建一个
[1] G. Nicholls,et al. Defining Conditions for the Etching of Silicon in an Inductive Coupled Plasma Reactor , 1999 .
[2] Namjin Jang,et al. Multiresponse optimization based on the desirability function for a pervaporation process for producing anhydrous ethanol , 2009 .
[3] Bo Liu,et al. Dry etching of AlTiC with CF/sub 4/ and H/sub 2/ for slider fabrication , 2003 .
[4] Yu. N. Grigoryev,et al. Specific features of intensification of silicon etching in CF4/O2 plasma , 2007 .
[5] Jinmo Kim,et al. Etching characterization of shaped hole high density plasma for using MEMS devices , 2005 .
[6] Jan Szmidt,et al. Reactive ion etching of novel materials—GaN and SiC , 2003 .
[7] R. Anilionis,et al. Investigation of Etching Process in Nano Structures , 2008 .
[8] Zhang Mingsheng,et al. Effect of pattern shape on etching wall profile in slider fabrication , 2006 .
[9] David B. Bogy,et al. Thermal dependence of MR signal on slider flying state , 2000 .
[10] Shahid Rauf,et al. Integrated equipment-feature modeling investigation of fluorocarbon plasma etching of SiO2 and photoresist , 2003 .
[11] R. Knizikevičius,et al. Influence of activated polymer on the etching rate of SiO2 in CF4+H2 plasma , 2009 .
[12] Yonhua Tzeng,et al. High‐Rate Anisotropic Etching of Silicon by Remote Microwave Plasma in Sulfur‐Hexafluoride , 1990 .
[13] Seiji Onoue,et al. Topography Simulation of Reactive Ion Etching Combined with Plasma Simulation, Sheath Model, and Surface Reaction Model , 2002 .
[14] Douglas C. Montgomery,et al. Modified Desirability Functions for Multiple Response Optimization , 1996 .
[15] R. Hsiao,et al. Fabrication of magnetic recording heads and dry etching of head materials , 1999, IBM J. Res. Dev..
[16] Jinmo Kim,et al. High aspect ratio via etching conditions for deep trench of silicon , 2003 .
[17] K. T. Kallis,et al. Optimization of reactive ion etching processes using desirability , 2010 .
[18] Qingyun Wu,et al. The size and space arrangement roles on coercivity of electrodeposited Co1−xCux nanowires , 2006 .
[19] T. Sato,et al. New reactive ion etching process for HDD slider fabrication , 1996 .
[20] Prabhakar R. Bandaru,et al. An experimental study of the reactive ion etching (RIE) of GaP using BCl3 plasma processing , 2007 .
[21] Bo Zhao,et al. Dry etching of AlN films using the plasma generated by fluoride , 2008 .