IGBT operation at cryogenic temperatures: non-punch-through and punch-through comparison
暂无分享,去创建一个
A. Caiafa | E. Santi | J. Hudgins | A. Snezhko | R. Prozorov
[1] B. Lengeler,et al. Semiconductor devices suitable for use in cryogenic environments , 1974 .
[2] Bantval J. Baliga,et al. Cryogenic operation of asymmetric N-channel IGBTs , 1992, Proceedings of the 4th International Symposium on Power Semiconductor Devices and Ics.
[3] B. Jayant Baliga,et al. Cryogenic operation of p-i-n power rectifiers , 1993, [1993] Proceedings of the 5th International Symposium on Power Semiconductor Devices and ICs.
[4] Jerry L. Hudgins,et al. Temperature variation effects in MCTs, IGBTs, and BMFETs , 1993, Proceedings of IEEE Power Electronics Specialist Conference - PESC '93.
[5] R. Singh,et al. Cryogenic operation of PiN power rectifiers , 1994 .
[6] Cryogenic operation of asymmetric n-channel IGBTs , 1995 .
[7] O. Mueller,et al. Properties of high-power Cryo-MOSFETs , 1996, IAS '96. Conference Record of the 1996 IEEE Industry Applications Conference Thirty-First IAS Annual Meeting.
[8] F. Rosenbauer,et al. Behaviour of IGBT Modules in the Temperature Range from 5 to 300 K , 1996 .
[9] S. Kolluri. Application of distributed superconducting magnetic energy storage system (D-SMES) in the entergy system to improve voltage stability , 2002, 2002 IEEE Power Engineering Society Winter Meeting. Conference Proceedings (Cat. No.02CH37309).
[10] Jerry L. Hudgins,et al. Cryogenic study and modeling of IGBTs , 2003, IEEE 34th Annual Conference on Power Electronics Specialist, 2003. PESC '03..