论文信息 - Wearout estimation using the Robustness Validation methodology for components in 150 degreeC ambient automotive applications

Wearout estimation using the Robustness Validation methodology for components in 150 degreeC ambient automotive applications

AEC-Q100 is the usual qualification reference for automotive ICs dedicated to applications up to 125 °C ambient temperature. Although qualification criteria have been defined which enable the qualification extension up to 150 °C, this might always not satisfy the requirements of automotive Zero Defect policy. The mission profile might for instance exceed the scope of AEC-Q100 verifications, or it might be impossible to predict when the wearout period will start depending on use, having gained very little knowledge of the degradation kinetics. This study provides a concrete analysis of potential customer exposure to wearout failure mechanisms based on the principles developed in SAE J1879 [1], Handbook for Robustness Validation of Semiconductor Devices in Automotive Application.

Hélène Frémont | Pascal Lecuyer | Manoubi Auguste Bahi | Jean-Pierre Landesman

[1] H. Fremont,et al. Degradation Mechanisms of Au–Al Wire Bonds During Qualification Tests at High Temperature for Automotive Applications: Quality Improvement by Process Modification , 2008, IEEE Transactions on Device and Materials Reliability.

[2] Hélène Frémont,et al. Sequential environmental stresses tests qualification for automotive components , 2007, Microelectron. Reliab..

[3] Hélène Frémont,et al. A new methodology for the identification of ball bond degradation during high-temperature aging tests on devices in standard plastic packages , 2009, Microelectron. Reliab..

[4] Corinne Bestory. Développement de stratégies de conception en vue de la fiabilité pour la simulation et la prévision des durées de vie de circuits intégrés dès la phase de conception , 2008 .

[5] Michel Mermet-Guyennet,et al. Revisiting power cycling test for better life-time prediction in traction , 2007, Microelectron. Reliab..

[6] Landesman Jean-Pierre,et al. A new methodology for the identification of ball bond degradation during high-temperature aging tests on devices in standard plastic packages , 2009 .

[7] G. Delarozee,et al. Introduction to reliability , 1999 .

[8] R.C. Blish,et al. Temperature cycling and thermal shock failure rate modeling , 1997, 1997 IEEE International Reliability Physics Symposium Proceedings. 35th Annual.