Thermally actuated, bistable, oxide/silicon/metal membranes

Thermally actuated, bistable, snapping membranes have been fabricated on a silicon wafer and tested. Nonlinear finite element analysis has been used to gain an understanding of the thermomechanical behavior of these devices. A unique feature of these membranes is that they buckle downward with an increase in temperature beyond a critical value, and remain in the downward buckled state as the temperature decreases back to its initial value. The demonstration devices consist of 2 mm2, 3–4 µm thick silicon membranes with a 1 µm thick layer of silicon dioxide grown on one side and a 3 µm thick layer of aluminum deposited onto the other side. The critical snapping temperature range is measured to be 55 °C ± 5 °C. The snapping temperature is varied by changing the membrane dimensions and/or the materials used to realize the composite membrane structure. Applications to thermal actuation devices and temperature indicators are envisioned.

[1]  Miko Elwenspoek,et al.  Buckled membranes for microstructures , 1994, Proceedings IEEE Micro Electro Mechanical Systems An Investigation of Micro Structures, Sensors, Actuators, Machines and Robotic Systems.

[2]  J. Bustillo,et al.  Surface micromachining for microelectromechanical systems , 1998, Proc. IEEE.

[3]  M.R.J. Gibbs,et al.  Magnetic materials for MEMS applications , 2004 .

[4]  C. Wilmsen,et al.  Buckling of thermally-grown SiO 2 thin films , 1972 .

[5]  B. Halg On a micro-electro-mechanical nonvolatile memory cell , 1990 .

[6]  C. Malhaire,et al.  Mechanical characterization and reliability study of bistable SiO2/Si membranes for microfluidic applications , 2002 .

[7]  Hans Joachim Quenzer,et al.  Bistable microvalve with pneumatically coupled membranes , 1996, Proceedings of Ninth International Workshop on Micro Electromechanical Systems.

[8]  Chang-Jin Kim,et al.  A bistable snapping microactuator , 1994, Proceedings IEEE Micro Electro Mechanical Systems An Investigation of Micro Structures, Sensors, Actuators, Machines and Robotic Systems.

[9]  D. Polla,et al.  PROCESSING AND CHARACTERIZATION OF PIEZOELECTRIC MATERIALS AND INTEGRATION INTO MICROELECTROMECHANICAL SYSTEMS , 1998 .

[10]  K. R. Farmer,et al.  A bistable microrelay based on two-segment multimorph cantilever actuators , 1998, Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176.

[11]  D. Barbier,et al.  Effect of Thermoelastic Stress on the Pressure Response of a Composite SiO 2 /Si Membrane , 1996 .

[12]  Kurt E. Petersen,et al.  Process for in-plane and out-of-plane single-crystal-silicon thermal microactuators , 1996 .

[13]  Jack W. Judy,et al.  Microelectromechanical systems (MEMS): fabrication, design and applications , 2001 .