WNx diffusion barriers between Si and Cu
暂无分享,去创建一个
Tomohiro Ohta | Masanori Murakami | Takeo Oku | T. Ohta | M. Murakami | Nakano Tadashi | T. Oku | Katsumi Takahiro | Sadae Yamaguchi | Masaki Uekubo | Kazushi Nii | Nakano Tadashi | S. Yamaguchi | K. Takahiro | M. Uekubo | K. Nii
[1] S. Raud,et al. Performance of W100−xNx diffusion barriers between 〈Si〉 and Cu , 1991 .
[2] M. Nicolet,et al. Sputtered Ta-Si-N diffusion barriers in Cu metallizations for Si , 1991, IEEE Electron Device Letters.
[3] L. G. Harrison. Influence of dislocations on diffusion kinetics in solids with particular reference to the alkali halides , 1961 .
[4] R. Gutmann,et al. Advanced multilayer metallization schemes with copper as interconnection metal , 1993 .
[5] J. S. Chen,et al. Tantalum‐based diffusion barriers in Si/Cu VLSI metallizations , 1991 .
[6] Lun-Lun Chen,et al. Interfacial reactions of ultrahigh‐vacuum‐deposited Cu thin films on atomically cleaned (111)Si. I. Phase formation and interface structure , 1993 .
[7] F. D. Boer. Cohesion in Metals: Transition Metal Alloys , 1989 .
[8] R. Evershed,et al. Mat Res Soc Symp Proc , 1995 .
[9] Tadashi Shibata,et al. Electrical Properties of Giant‐Grain Copper Thin Films Formed by a Low Kinetic Energy Particle Process , 1992 .
[10] J. D. Wiley,et al. Crystallization of sputter deposited amorphous metal thin films , 1986 .
[11] Tomohiro Ohta,et al. Diffusion barrier effects of transition metals for Cu/M/Si multilayers (M=Cr, Ti, Nb, Mo, Ta, W) , 1994 .
[12] Karen Holloway,et al. Tantalum as a diffusion barrier between copper and silicon: Failure mechanism and effect of nitrogen additions , 1992 .
[13] J. S. Chen,et al. Amorphous Ta-Si-N diffusion barriers in Si/Al and Si/Cu metallizations , 1991 .
[14] S. M. Sze,et al. Physics of semiconductor devices , 1969 .
[15] Ki-Bum Kim,et al. Reactively sputtered TiN as a diffusion barrier between Cu and Si , 1990 .
[16] Shizhi Wang,et al. Diffusion barrier properties of TiW between Si and Cu , 1993 .
[17] M. Nicolet,et al. WNx: Properties and applications , 1987 .