A Review of 5G Front-End Systems Package Integration

Increasing data rates, spectrum efficiency and energy efficiency have been driving major advances in the design and hardware integration of RF communication networks. In order to meet the data rate and efficiency metrics, 5G networks have emerged as a follow-on to 4G, and projected to have 100X higher wireless date rates and 100X lower latency than those with current 4G networks. Major challenges arise in the packaging of radio-frequency front-end modules because of the stringent low signal-loss requirements in the millimeter-wave frequency bands, and precision-impedance designs with smaller footprints and thickness. Heterogeneous integration in 3D ultra-thin packages with higher component densities and performance than with the existing 2D packages is needed to realize such 5G systems. This paper reviews the key building blocks of 5G systems and the underlying advances in packaging technologies to realize them.

[1]  C. T. Wang,et al.  Fabrication and Characterization of Millimeter Wave 3D InFO Dipole Antenna Array Integrated with CMOS Front-end Circuits , 2019, 2019 IEEE International Electron Devices Meeting (IEDM).

[2]  Madhavan Swaminathan,et al.  Low-Loss Impedance-Matched Sub-25-μm Vias in 3-D Millimeter-Wave Packages , 2020, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[3]  John L. Volakis,et al.  Wideband RF Self-Interference Cancellation Circuit for Phased Array Simultaneous Transmit and Receive Systems , 2018, IEEE Access.

[4]  Che-Wei Hsu,et al.  High Performance Chip-Partitioned Millimeter Wave Passive Devices on Smooth and Fine Pitch InFO RDL , 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

[5]  Lixi Wan,et al.  Electrical, Thermal and Mechanical Simulation for Embedded Silicon Fan-out Wafer Level Packaging , 2018, 2018 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA).

[6]  Gabriel M. Rebeiz,et al.  A Scalable 64-Element 280Hz Phased-Array Transceiver with 50 dBm EIRP and 8–12 Gbps 5G Link at 300 Meters without any Calibration , 2018, 2018 IEEE/MTT-S International Microwave Symposium - IMS.

[7]  Sasha N. Oster,et al.  Investigation of a photodefinable glass substrate for millimeter-wave radios on package , 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

[8]  Duixian Liu,et al.  Antenna-on-Chip and Antenna-in-Package Solutions to Highly Integrated Millimeter-Wave Devices for Wireless Communications , 2009, IEEE Transactions on Antennas and Propagation.

[9]  Yoichiro Sato,et al.  Low-Loss Glass Substrates Formulated with a Variety of Dielectric Characteristics for Millimeter-Wave Applications , 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

[10]  Kilsoo Kim,et al.  Advanced Fan-Out Package SI/PI/Thermal Performance Analysis of Novel RDL Packages , 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

[11]  John L. Volakis,et al.  Simultaneous transmit and receive system architecture with four stages of cancellation , 2015, 2015 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting.

[12]  J. Bock,et al.  SiGe BiCMOS and eWLB packaging technologies for automotive radar solutions , 2015, 2015 IEEE MTT-S International Conference on Microwaves for Intelligent Mobility (ICMIM).

[13]  Y. Baeyens,et al.  A 16-element W-band phased array transceiver chipset with flip-chip PCB integrated antennas for multi-gigabit data links , 2015, 2015 IEEE Radio Frequency Integrated Circuits Symposium (RFIC).

[14]  Rao Tummala,et al.  First Demonstration of Ultra-Thin Glass Panel Embedded (GPE) Package with Sheet Type Epoxy Molding Compound for 5G/mm-wave Applications , 2019, International Symposium on Microelectronics.

[15]  Chung-Hao Tsai,et al.  Array antenna integrated fan-out wafer level packaging (InFO-WLP) for millimeter wave system applications , 2013, 2013 IEEE International Electron Devices Meeting.

[16]  Kiburm Ahn,et al.  A Ka-band multilayer LTCC 4-pole bandpass filter using dual-mode cavity resonators , 2008, 2008 IEEE MTT-S International Microwave Symposium Digest.

[17]  Tan-Phu Vuong,et al.  High performance air-filled substrate integrated waveguide filter post-process tuning using capacitive post , 2017, 2017 IEEE MTT-S International Microwave Symposium (IMS).

[18]  Madhavan Swaminathan,et al.  Glass-Based IC-Embedded Antenna-Integrated Packages for 28-GHz High-Speed Data Communications , 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

[19]  Cheng-Yu Ho,et al.  Advanced Thin-Profile Fan-Out with Beamforming Verification for 5G Wideband Antenna , 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

[20]  Rao R. Tummala,et al.  Advanced Low-Loss and High-Density Photosensitive Dielectric Material for RF/Millimeter-Wave Applications , 2019, 2019 International Wafer Level Packaging Conference (IWLPC).

[21]  Andreas Stelzer,et al.  120-GHz and 240-GHz Broadband Bow-Tie Antennas in eWLB Package for High Resolution Radar Applications , 2018, 2018 48th European Microwave Conference (EuMC).

[22]  Akira Shimada,et al.  Low Dispersion Loss Polyimides for High Frequency Applications , 2018, 2018 IEEE CPMT Symposium Japan (ICSJ).

[23]  Lianming Li,et al.  A 1 × 2 Taper Slot Antenna Array With Flip-Chip Interconnect via Glass-IPD Technology for 60 GHz Radar Sensors , 2020, IEEE Access.

[24]  Akkermans Hans,et al.  Use Cases and Requirements , 2015 .

[25]  M. Ruberto,et al.  A CMOS Bidirectional 32-Element Phased-Array Transceiver at 60 GHz With LTCC Antenna , 2012, IEEE Transactions on Microwave Theory and Techniques.

[26]  Wonbin Hong,et al.  24-Element Antenna-in-Package for Stationary 60-GHz Communication Scenarios , 2011, IEEE Antennas and Wireless Propagation Letters.

[27]  Madhavan Swaminathan,et al.  Heterogeneous Integration of 5G and Millimeter-Wave Diplexers with 3D Glass Substrates , 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

[28]  Atif Shamim,et al.  SIW Cavity Filters with Embedded Planar Resonators in LTCC Package for 5G Applications , 2018, 2018 48th European Microwave Conference (EuMC).

[29]  John L. Volakis,et al.  Multi-band multi-beam performance evaluation of on-site coding digital beamformer using ultra-wideband antenna array , 2017, 2017 XXXIInd General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS).

[30]  Saurabh Sinha,et al.  Replacing copper interconnects with graphene at a 7-nm node , 2017, 2017 IEEE International Interconnect Technology Conference (IITC).

[31]  Gabriel M. Rebeiz,et al.  2x64 Dual-Polarized Dual-Beam Single-Aperture 28 GHz Phased Array with High Cross-Polarization Rejection for 5G Polarization MIMO , 2019, 2019 IEEE MTT-S International Microwave Symposium (IMS).

[32]  Hong-Teuk Kim,et al.  A 28-GHz CMOS Direct Conversion Transceiver With Packaged $2 \times 4$ Antenna Array for 5G Cellular System , 2018, IEEE Journal of Solid-State Circuits.

[33]  H. Vincent Poor,et al.  Ultrareliable and Low-Latency Wireless Communication: Tail, Risk, and Scale , 2018, Proceedings of the IEEE.

[34]  Y. Yoon,et al.  Cu/Co Multilayer-Based High Signal Integrity and Low RF Loss Conductors for 5G/Millimeter Wave Applications , 2018, IEEE Transactions on Microwave Theory and Techniques.

[35]  Manos M. Tentzeris,et al.  First Demonstration of 28 GHz and 39 GHz Transmission Lines and Antennas on Glass Substrates for 5G Modules , 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

[36]  Duixian Liu,et al.  Development, Implementation, and Characterization of a 64-Element Dual-Polarized Phased-Array Antenna Module for 28-GHz High-Speed Data Communications , 2019, IEEE Transactions on Microwave Theory and Techniques.

[37]  Kemal Aygün,et al.  Impact of Use Conditions on Dielectric and Conductor Material Models for High-Speed Package Interconnects , 2019, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[38]  Kilsoo Kim,et al.  The Thermal Dissipation Characteristics of The Novel System-In-Package Technology (ICE-SiP) for Mobile and 3D High-end Packages , 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

[39]  Mohamed-Slim Alouini,et al.  A Key 6G Challenge and Opportunity—Connecting the Base of the Pyramid: A Survey on Rural Connectivity , 2020, Proceedings of the IEEE.

[40]  Holger Maune,et al.  Attenuation of high Frequency Signals in Structured Metallization on Glass: Comparing Different Metallization Techniques with 24 GHz, 77 GHz and 100 GHz Structures , 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

[41]  Ke Wu,et al.  Self-Packaged Millimeter-Wave Substrate Integrated Waveguide Filter With Asymmetric Frequency Response , 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[42]  AKHIL GUPTA,et al.  A Survey of 5G Network: Architecture and Emerging Technologies , 2015, IEEE Access.

[43]  Madhavan Swaminathan,et al.  Multi-Physics Modeling and Characterization of Components on Flexible Substrates , 2019, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[44]  Zhangming Zhu,et al.  Millimeter-Wave Antenna-in-Package Applications Based on D263T Glass Substrate , 2020, IEEE Access.

[45]  Ho-Jin Song,et al.  Packages for Terahertz Electronics , 2017, Proceedings of the IEEE.

[46]  C. S. Liu,et al.  High performance passive devices for millimeter wave system integration on integrated fan-out (InFO) wafer level packaging technology , 2015, 2015 IEEE International Electron Devices Meeting (IEDM).

[47]  John L. Volakis,et al.  Multiband and Multibeam Direction of Arrival Estimation Using On-Site Coding Digital Beamformer , 2017, IEEE Antennas and Wireless Propagation Letters.

[48]  Manos M. Tentzeris,et al.  First Demonstration of Compact, Ultra-Thin Low-Pass and Bandpass Filters for 5G Small-Cell Applications , 2018, IEEE Microwave and Wireless Components Letters.

[49]  Manos M. Tentzeris,et al.  Leading-Edge and Ultra-Thin 3D Glass-Polymer 5G Modules with Seamless Antenna-to-Transceiver Signal Transmissions , 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

[50]  Rao Tummala,et al.  Nanostructured miniaturized artificial magnetic conductors (AMC) for high-performance antennas in 5G, IoT, and smart skin applications , 2017, 2017 IEEE 17th International Conference on Nanotechnology (IEEE-NANO).

[51]  Vladimir Aparin,et al.  A 28GHz Bulk-CMOS dual-polarization phased-array transceiver with 24 channels for 5G user and basestation equipment , 2018, 2018 IEEE International Solid - State Circuits Conference - (ISSCC).

[52]  Mark Yeck,et al.  7.2 A 28GHz 32-element phased-array transceiver IC with concurrent dual polarized beams and 1.4 degree beam-steering resolution for 5G communication , 2017, 2017 IEEE International Solid-State Circuits Conference (ISSCC).

[53]  Gabriel M. Rebeiz,et al.  A 28 GHz transceiver chip for 5G beamforming data links in SiGe BiCMOS , 2017, 2017 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM).

[54]  Fuhan Liu,et al.  Design and demonstration of Glass Panel Embedding for 3D System Packages for heterogeneous integration applications , 2018 .

[55]  Pulugurtha Markondeya Raj,et al.  Sintered Nanocopper Paste for High-Performance 3D Heterogeneous Package Integration , 2020, Journal of Electronic Materials.

[56]  Jameel Showail,et al.  System on Package (SoP) Millimeter Wave Filters for 5G Applications , 2018 .

[57]  Ruey-Beei Wu,et al.  Highly Selective Microstrip Bandpass Filters in Ka-Band , 2002, 2002 32nd European Microwave Conference.

[58]  Seahee Hwangbo,et al.  28GHz Through Glass Via (TGV) Based Band Pass Filter Using Through Fused Silica Via (TFV) Technology , 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

[59]  Sanghoon Sim,et al.  A Compact 28 GHz RF Front-end Module using IPDs and Wafer-level Metal Fan-out Packaging , 2019, 2019 49th European Microwave Conference (EuMC).

[60]  Duixian Liu,et al.  A multilayer organic package with 64 dual-polarized antennas for 28GHz 5G communication , 2017, 2017 IEEE MTT-S International Microwave Symposium (IMS).

[61]  M. Wojnowski,et al.  A 77-GHz SiGe single-chip four-channel transceiver module with integrated antennas in embedded wafer-level BGA package , 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

[62]  G. Freeman,et al.  Performance of V-Band On-Chip Antennas in GlobalFoundries 45nm CMOS SOI Process for Mm-Wave 5G Applications , 2018, 2018 IEEE/MTT-S International Microwave Symposium - IMS.

[63]  Anupam Choubey,et al.  Photopatternable Laminate BCB Dielectric , 2014 .

[64]  Gaofeng Wang,et al.  Analysis of Cu-Graphene Interconnects , 2018, IEEE Access.

[65]  Alexander Tomkins,et al.  Compact 60 GHz Phased-Array Antennas With Enhanced Radiation Properties in Flip-Chip BGA Packages , 2019, IEEE Transactions on Antennas and Propagation.

[66]  Joseph Staudinger,et al.  5G Infrastructure RF Solutions: Challenges and Opportunities , 2019, IEEE Microwave Magazine.

[67]  Duixian Liu,et al.  An Aperture-Coupled Dual-Polarized Stacked Patch Antenna for Multi-Layer Organic Package Integration , 2019, 2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting.

[68]  Yifei Yuan,et al.  Potential key technologies for 6G mobile communications , 2019, Science China Information Sciences.

[69]  Vempati Srinivasa Rao,et al.  Panel Warpage of Fan-Out Panel-Level Packaging Using RDL-First Technology , 2020, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[70]  Li Gao,et al.  Microwave and Millimeter-Wave LTCC Filters Using Discriminating Coupling for Mode Suppression , 2016, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[71]  Hongyu Zhou,et al.  A Fully Integrated Ka-Band Front End for 5G Transceiver , 2016, 2016 IEEE MTT-S International Microwave Symposium (IMS).

[72]  Matti Latva-aho,et al.  Key drivers and research challenges for 6G ubiquitous wireless intelligence , 2019 .

[73]  Manos M. Tentzeris,et al.  Miniaturized High-Performance Filters for 5G Small-Cell Applications , 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

[74]  Walid Saad,et al.  A Vision of 6G Wireless Systems: Applications, Trends, Technologies, and Open Research Problems , 2019, IEEE Network.

[75]  Duixian Liu,et al.  A Fully-Integrated 16-Element Phased-Array Receiver in SiGe BiCMOS for 60-GHz Communications , 2010, IEEE Journal of Solid-State Circuits.

[76]  Seung Yong Cha,et al.  Electrical and Thermal Co-Analysis of Thermally Efficient SiP for High Performance Applications , 2019, 2019 Electrical Design of Advanced Packaging and Systems (EDAPS).

[77]  Daniel F. Sievenpiper,et al.  Method for Extracting the Effective Tensor Surface Impedance Function From Nonuniform, Anisotropic, Conductive Patterns , 2019, IEEE Transactions on Antennas and Propagation.

[78]  Pouya Talebbeydokhti,et al.  Novel Multicore PCB and Substrate Solutions for Ultra Broadband Dual Polarized Antennas for 5G Millimeter Wave Covering 28GHz & 39GHz Range , 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

[79]  Ultra-Reliable Low-Latency 5G for Industrial Automation , 2018 .

[80]  Duixian Liu,et al.  LTCC Packages With Embedded Phased-Array Antennas for 60 GHz Communications , 2011, IEEE Microwave and Wireless Components Letters.

[81]  Ahmed A. Kishk,et al.  Self-Packaged, Low-Loss, Planar Bandpass Filters for Millimeter-Wave Application Based on Printed Gap Waveguide Technology , 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.