A 6–10 mW Power Amplifier at 290–307.5 GHz in 250 nm InP HBT

A 290-307.5 GHz solid-state power-amplifier MMIC is presented demonstrating 6-10 mW Pout for Pin <; 0.8 mW. PDC is 848 mW. This represents 10-12 dB of large-signal gain across 18 GHz of high-power bandwidth. This 3-stage amplifier has peak 23.5 dB S21 gain at 299 GHz, a 1 dB bandwidth from 292-303 GHz, and a 3 dB bandwidth from 285-306 GHz. A power-cascode cell topology is used for the PA unit cell and 2:1 Wilkinson power combining of these cells (32 um HBT output periphery) achieves the RF powers claimed. The insertion loss demonstrated by the combiner is 0.45-0.5 dB from 255-330 GHz-this improves upon state-of-the-art for on-wafer 2:1 combining at these frequencies by 0.3-0.7 dB. This work represents the first demonstration of a 300 GHz power cascode cell topology with output power and output power density (W/mm) competitive with state-of-the-art PAs with 10 mW Pout.

[1]  Z. Griffith,et al.  Multi-finger 250nm InP HBTs for 220GHz mm-wave power , 2012, 2012 International Conference on Indium Phosphide and Related Materials.

[2]  Jinho Jeong,et al.  H-Band Power Amplifier Integrated Circuits Using 250-nm InP HBT Technology , 2015, IEEE Transactions on Terahertz Science and Technology.

[3]  Po-Hsin Liu,et al.  A 10-mW Submillimeter-Wave Solid-State Power-Amplifier Module , 2010, IEEE Transactions on Microwave Theory and Techniques.

[4]  Richard Lai,et al.  220-GHz Solid-State Power Amplifier Modules , 2012, IEEE Journal of Solid-State Circuits.

[5]  Sanggeun Jeon,et al.  300 GHz InP HBT amplifier with 10 mW output power , 2014 .