Silicon Carrier with Deep Through-Vias, Fine Pitch Wiring and Through Cavity for Parallel Optical Transceiver
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D. Edelstein | P. Andry | C. Tsang | K. Kwietniak | E. Sprogis | J. Knickerbocker | L. P. Buchwalter | R. Horton | J. Magerlein | C. Patel | D. Canaperi | Y. Kwark | C. Baks | F. Doany | R. Budd | C. Schuster | J. Rosner | H. Nyikal | T. Krywanczyk