SOLDER FATIGUE AND THERMAL CHARACTERIZATION OF A SILICON BASED MULTI-CHIP MODULE PACKAGE UTILIZING FINITE ELEMENT ANALYSIS METHODOLOGIES

Viscoplastic finite-element simulation methodologies were utilized to predict ball and bump solder joint reliability for a silicon based five-chip multi-chip module package under accelerated temperature cycling conditions (0C to +100C, 5min ramp/5min dwell). The analyses utilized the ANSYS sub-modeling methodology by which global model simulation results were applied as boundary conditions in localized sub-models of the solder balls and bumps. Multiple ball and bump configurations consisting of both 63Sn/37Pb eutectic and 90Pb/10Sn high temperature solder materials were investigated. The solder structures accommodate the bulk of the plastic strain which is generated during accelerated temperature cycling due to the thermal expansion mismatch between the various stack-up materials in the silicon based package. Since plastic strain is a dominant parameter that influences low-cycle fatigue, it was used as a basis for evaluation of solder structural integrity. The finite element analysis was extended to evaluate the steady-state thermal performance of the multi-chip module system. A full-symmetry, threedimensional finite element model was required due to the non-symmetric nature of the five-chip multi-chip module package. The finite element analysis methodology utilized temperature dependent surface coefficients to account for the combined non-linear effects of natural convection and radiation heat transfer. Multiple analyses were executed in order to quantify the required case-to-ambient thermal resistance (θca) necessary to properly cool the package with a heat sink or heat pipe apparatus. The paper discusses the evaluation methodologies as implemented in the ANSYS finite element simulation software tool and the corresponding results for the solder bump/ball fatigue and steady-state thermal analyses. Some ANSYS parametric design language is included for the benefit of those readers who are familiar with the software tool. Index Terms – microelectronic package characterization, solder fatigue analysis, viscoplastic strain energy density, thermal analysis, finite element modeling.

[1]  B. M. Guenin,et al.  Methodology for thermal evaluation of multichip modules , 1995, Proceedings of 1995 IEEE/CPMT 11th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

[2]  W. Engelmaier,et al.  Functional Cycles and Surface Mounting Attachment Reliability , 1985 .

[3]  Robert Darveaux,et al.  Solder Joint Fatigue Life Model , 1997 .

[4]  L. Anand.  Constitutive Equations for the Rate-Dependent Deformation of Metals at Elevated Temperatures , 1982 .

[5]  B. A. Zahn.  Steady state thermal characterization and junction temperature estimation of multi-chip module packages using the response surface method , 1998, ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208).

[6]  S. E. Yamada,et al.  A fracture mechanics approach to soldered joint cracking , 1989 .

[7]  J. M. Fusaro,et al.  Reliability model for micro-miniature electronic packages , 1997 .

[8]  Ravichandren Shbrahmanyan.  A damage integral approach for low-cycle isothermal and thermal fatigue , 1990 .

[9]  A. Syed,et al.  Creep Crack Growth Prediction of Solder Joints During Temperature Cycling—An Engineering Approach , 1995 .

[10]  D. E. Helling,et al.  A creep-rupture model for two-phase eutectic solders , 1988 .

[11]  J. A. Augis,et al.  A comprehensive surface mount reliability model (CSMR) covering several generations of packaging and assembly technology , 1993 .

[12]  Yi-Hsin Pao.  A fracture mechanics approach to thermal fatigue life prediction of solder joints , 1992 .

[13]  F. Sarvar,et al.  Examination of natural convection plumes from partially heated PCB plates and estimation of the heat transfer coefficients , 1993 .

[14]  Avram Bar-Cohen.  Thermal Management of Air- and Liquid-Cooled Multichip Modules , 1987 .

[15]  Z. Johnson.  Implementation of and extensions to Darveaux's approach to finite-element simulation of BGA solder joint reliability , 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).

[16]  B. A. Zahn,et al.  Evaluation of isothermal and isoflux natural convection coefficient correlations for utilization in electronic package level thermal analysis , 1997, Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium.

[17]  M. Shine,et al.  Fatigue of solder joints in surface mount devices , 1988 .

[18]  G.B. Kromann.  Thermal management for ceramic multichip modules: experimental program , 1992, Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92.

[19]  M. Amagai,et al.  Chip scale package (CSP) solder joint reliability and modeling , 1999, 1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173).

[20]  B. A. Zahn.  Steady state thermal characterization of multiple output devices using linear superposition theory and a non-linear matrix multiplier , 1998, Fourteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.98CH36195).

[21]  Michael Pecht,et al.  Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach , 1992 .