A new data retention mechanism after endurance stress on flash memory

We propose a new data retention model after endurance stress that may be explained as a combination of two retention mechanisms. One inherent retention characteristic is ruled by thermionic emission and is dominant above 150 C. The other retention mechanism is dominant below 85 to 125 C and is controlled by anomalous SILC. We have clarified that the data retention properties after P/E cycling were well fitted by the hopping conduction model. In particular, the presence of traps generated by excessive P/E cycling played a significant role in the temperature dependence of the retention lifetime.

[1]  A. Bhattacharyya,et al.  Modelling of write/erase and charge retention characteristics of floating gate EEPROM devices , 1984 .

[2]  M. Wada,et al.  Stress induced leakage current limiting to scale down EEPROM tunnel oxide thickness , 1988, Technical Digest., International Electron Devices Meeting.

[3]  T. Kobayashi,et al.  Monte Carlo simulation of stress-induced leakage current by hopping conduction via multi-traps in oxide , 1998, International Electron Devices Meeting 1998. Technical Digest (Cat. No.98CH36217).

[4]  C. Hu,et al.  Deep-trap SILC (stress induced leakage current) model for nominal and weak oxides , 1998, 1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173).

[5]  R. S. Scott,et al.  Limitations on oxide thicknesses in flash EEPROM applications , 1996, Proceedings of International Reliability Physics Symposium.

[6]  D. Baglee,et al.  The effects of write/erase cycling on data loss in EEPROMs , 1985, 1985 International Electron Devices Meeting.

[7]  Susumu Kohyama,et al.  A Thermionic Electron Emission Model for Charge Retention in SAMOS Structure , 1982 .

[8]  J. F. Conley Application of Electron Spin Resonance as a Tool for Building In Reliability (BIR) , 1996 .

[9]  Katsuhiko Kubota,et al.  Anomalous Leakage Current Model for Retention Failure in Flash Memories , 1999 .

[10]  J. T. Clemens,et al.  Field dependent critical trap density for thin gate oxide breakdown , 1999, 1999 IEEE International Reliability Physics Symposium Proceedings. 37th Annual (Cat. No.99CH36296).

[11]  Field enhanced oxide charge detrapping in n-MOSFET's , 1996, Proceedings of International Reliability Physics Symposium.

[12]  B. De Salvo,et al.  A new physical model for NVM data-retention time-to-failure , 1999, 1999 IEEE International Reliability Physics Symposium Proceedings. 37th Annual (Cat. No.99CH36296).

[13]  R. Fowler,et al.  Electron Emission in Intense Electric Fields , 1928 .

[14]  R. Shirota,et al.  Extended data retention process technology for highly reliable flash EEPROMs of 10/sup 6/ to 10/sup 7/ W/E cycles , 1998, 1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173).

[15]  Excess currents induced by hot-hole injection and F-N stress in thin SiO/sub 2/ films [flash memories] , 1996, Proceedings of International Reliability Physics Symposium.