3D IC heterogeneous integration of GPS RF receiver, baseband, and DRAM on CoWoS with system BIST solution

A 3D IC heterogeneous chip integration of 65nm RF receiver, 28nm baseband processor, and 40nm DRAM on a proprietary CoWoS structure is demonstrated and its electrical characterization of KGS (Known Good Stack) has revealed a highly comparable system performance as compared to that of the KGD (Known Good Die) testing data. Moreover, an innovative system BIST (Built-in-Self-Test) scheme and methodology have been designed to save screening time by over 90% as compared to that of the conventional ATE full functional test. This work also exhibits an emerging application possibility for all other CoWoS related system integration such as smart mobile devices, smart consumer electronics, remote medical diagnosis and smart car telemetry, etc.