This paper describes a way of screen-printing PZT (lead-zirconate-titanate) onto silicon substrates. Initial experiments of printing a PZT-ink on a native oxide-covered Si-substrate showed contamination of the silicon substrate by lead diffusion during the firing stage of the film. This occurred also on thin-film deposited silicon oxide or silicon nitride layers. The effect of this is potentially catastrophic as conduction occurs between areas required to be electrically isolated by the thin film. The problem was solved by using a screen-printed barrier layer of IP211 (Heraeus), which also reduces the diffusion and prevents the conduction.