Efficient full-chip thermal modeling and analysis
暂无分享,去创建一个
Lawrence T. Pileggi | Peng Li | Mehdi Asheghi | Rajit Chandra | L. Pileggi | M. Asheghi | R. Chandra | Peng Li
[1] M. N. Özişik. Boundary value problems of heat conduction , 1989 .
[2] K. Stüben,et al. Multigrid methods: Fundamental algorithms, model problem analysis and applications , 1982 .
[3] Chenming Hu,et al. Characterization of self-heating in advanced VLSI interconnect lines based on thermal finite element simulation , 1998 .
[4] Sung-Mo Kang,et al. Electrothermal Analysis of VLSI Systems , 2000 .
[5] Sung-Mo Kang,et al. ILLIADS-T: an electrothermal timing simulator for temperature-sensitive reliability diagnosis of CMOS VLSI chips , 1998, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..
[6] G. B. Kromann. Thermal management of a C4/ceramic-ball-grid array: the Motorola PowerPC 603/sup TM/ and PowerPC 604/sup TM/ RISC microprocessors , 1996, Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings.
[7] Kaustav Banerjee,et al. Compact modeling and SPICE-based simulation for electrothermal analysis of multilevel ULSI interconnects , 2001, IEEE/ACM International Conference on Computer Aided Design. ICCAD 2001. IEEE/ACM Digest of Technical Papers (Cat. No.01CH37281).
[8] Stephen H. Gunther,et al. Managing the Impact of Increasing Microprocessor Power Consumption , 2001 .
[9] Sachin S. Sapatnekar,et al. Efficient Thermal Placement of Standard Cells in 3D ICs using a Force Directed Approach , 2003, ICCAD.
[10] J. W. Ruge,et al. 4. Algebraic Multigrid , 1987 .
[11] William L. Briggs,et al. A multigrid tutorial , 1987 .
[12] Sung-Mo Kang,et al. Cell-level placement for improving substrate thermal distribution , 2000, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..
[13] A. Brandt,et al. The Multi-Grid Method for the Diffusion Equation with Strongly Discontinuous Coefficients , 1981 .
[14] Robert W. Dutton,et al. Fast placement-dependent full chip thermal simulation , 2001, 2001 International Symposium on VLSI Technology, Systems, and Applications. Proceedings of Technical Papers (Cat. No.01TH8517).
[15] Charlie Chung-Ping Chen,et al. 3-D Thermal-ADI: a linear-time chip level transient thermal simulator , 2002, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..
[16] S. Nassif,et al. Full chip leakage-estimation considering power supply and temperature variations , 2003, Proceedings of the 2003 International Symposium on Low Power Electronics and Design, 2003. ISLPED '03..