PCB dual-switch fuse with energetic materials embedded: Application for new fail-safe and fault-tolerant converters

Abstract In this article a generic and passive dual-switch fuse is designed to symmetrically disconnect a switching cell against a leg short circuit failure. A compact FR4 copper tracks – PCB structure is proposed combining a dual-fuse mode and a passive dual-switch mode thanks to the integration of energetic material embedded in the thickness of the assembly. Firstly, we present the mechanical design of the dual-switch and the first tests of rupture by means of assisted an energetic material buried. In a second step, we describe the design of the dual-fuse on PCB and electrothermal finite elements simulations by means of Comsol 3D™. Finally, a combined dual-switch fuse prototype is fully integrated and validated at DC350V–AC15A in a voltage source inverter.

[1]  J. Adam.  New correlations between electrical current and temperature rise in PCB traces , 2004, Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545).

[2]  Franck Mosser,et al.  Complete short-circuit failure mode properties and comparison based on IGBT standard packaging. Application to new fault-tolerant inverter and interleaved chopper with reduced parts count , 2011, Proceedings of the 2011 14th European Conference on Power Electronics and Applications.

[3]  J. A. Ferreira,et al.  Thermal design guideline of PCB traces under DC and AC current , 2009, 2009 IEEE Energy Conversion Congress and Exposition.

[4]  C. Schaeffer,et al.  Electrothermal model of a fuse , 1996, IAS '96. Conference Record of the 1996 IEEE Industry Applications Conference Thirty-First IAS Annual Meeting.

[5]  D. Boroyevich,et al.  Fault-Tolerant Multilevel Converter Topology , 2006, 2006 IEEE International Symposium on Industrial Electronics.

[6]  Tsung-Yu Pan,et al.  Current carrying capacity of copper conductors in printed wiring boards , 1993, Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93).