论文信息 - Investigations of stress sensitivity of 0.12 CMOS technology using process modeling

Investigations of stress sensitivity of 0.12 CMOS technology using process modeling

This paper presents a mechanical analysis of the entire process flow (i.e.: Front (FEOL) and Back (BEOL) End of Line) of a 0.12 CMOS technology using 2D numerical modeling. This study gives several quantitative modifications concerning the process conditions and device geometries in order to reduce the residual mechanical stress in the devices.

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