论文信息 - Experimental study and modeling of microwave bond wire interconnects

Experimental study and modeling of microwave bond wire interconnects

We present a comprehensive characterization and study of various wire bond interconnect configurations for microwave integrated circuit packaging. Wire bond interconnects with two different bond types (ball-crescent and wedge), two different loop types (tight and loose) and various lengths are fabricated and experimentally characterized. We show the performance comparison of these configurations and develop an electromagnetic and a simple lumped-element equivalent circuit model.

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