Electronic packaging in the 1990s-a perspective from America

The advanced packaging technologies that can be expected in the 1990s in high-performance systems are discussed in terms of chip connection, power distribution, heat removal, and thick- and thin-film wiring and package interconnections. The following topics are discussed in detail: (1) chip-level connection providing the required connections between the chip and the package; (2) power distribution to the chip and heat removal from the chip; (3) first-level packages providing all the necessary wiring, interconnections, and power distribution; (4) first-to-second level interconnections; and (5) second-level packages providing all the necessary wiring, connections, power distribution, and power supply connection. >

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