With nanoscale semiconductor technology, circuit performance is increasingly influenced by details of the manufacturing process. An increasing number of manufacturing features, which are not included in standard design tools, affect both circuit performance and yield. One source of circuit performance degradation is lithography imperfections. Therefore, we need to simulate how lithography imperfections impact circuit performance. Such imperfections include the proximity effect, lens aberrations, and flare. These imperfections in lithography impact circuit timing. This paper introduces a method to incorporate the proximity effect, lens aberrations, and flare in timing simulation. Our method involves expanding and revising the cell library by considering optical effects. ISCAS benchmark circuits are used to evaluate the circuit performance impact of each optical effect.
[1]
Mark Horowitz,et al.
Timing Models for MOS Circuits
,
1983
.
[2]
Costas J. Spanos,et al.
Use of short-loop electrical measurements for yield improvement
,
1995
.
[3]
Wojciech Maly,et al.
Analysis of the impact of proximity correction algorithms on circuit performance
,
1999
.
[4]
Iwao Nishiyama,et al.
Impact of EUV light scatter on CD control as a result of mask density changes
,
2002,
SPIE Advanced Lithography.
[5]
Kurt Keutzer,et al.
Impact of spatial intrachip gate length variability on theperformance of high-speed digital circuits
,
2002,
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..