Partial EBG Structure with DeCap for Ultra‐wideband Suppression of Simultaneous Switching Noise in a High‐Speed System

To supply a power distribution network with stable power in a high-speed mixed mode system, simultaneous switching noise caused at the multilayer PCB and package structures needs to be sufficiently suppressed. The uni-planar compact electromagnetic bandgap (UC-EBG) structure is well known as a promising solution to suppress the power noise and isolate noise-sensitive analog/RF circuits from a noisy digital circuit. However, a typical UC-EBG structure has several severe problems, such as a limitation in the stop band’s lower cutoff frequency and signal quality degradation. To make up for the defects of a conventional EBG structure, a partially located EBG structure with decoupling capacitors is proposed in this paper as a means of both suppressing the power noise propagation and minimizing the effects of the perforated reference plane on the signal quality. The proposed structure is validated and investigated through simulation and measurement in both frequency and time domains. Keywords: Electromagnetic bandgap (EBG), signal integrity (SI), power integrity (PI), simultaneous switching noise (SSN), decoupling capacitor (DeCap).

[1]  Tzong-Lin Wu,et al.  A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures , 2004 .

[2]  Dong-Wook Kim,et al.  Bandwidth Enhancement for SSN Suppression Using a Spiral-Shaped Power Island and a Modified EBG Structure for a λ/4 Open Stub , 2009 .

[3]  R. Abhari,et al.  Suppression of the parallel-plate noise in high-speed circuits using a metallic electromagnetic band-gap structure , 2002, 2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278).

[4]  O.M. Ramahi,et al.  A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface , 2003, IEEE Microwave and Wireless Components Letters.

[5]  Tzong-Lin Wu,et al.  Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits , 2005, IEEE Transactions on Microwave Theory and Techniques.

[6]  Tzong-Lin Wu,et al.  A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures , 2004, IEEE Microwave and Wireless Components Letters.

[7]  J. Mayer.  Advanced packaging , 1986 .

[8]  Barry Kent Gilbert,et al.  High-frequency characterization of power/ground-plane structures , 1999 .

[9]  Jong-Hwa Kwon,et al.  Partial Placement of EBG on Both Power and Ground Planes for Broadband Suppression of Simultaneous Switching Noise , 2009, IEICE Trans. Commun..

[10]  Joungho Kim,et al.  Power distribution networks for system-on-package: status and challenges , 2004, IEEE Transactions on Advanced Packaging.

[11]  O.M. Ramahi,et al.  Electromagnetic interference (EMI) reduction from printed circuit boards (PCB) using electromagnetic bandgap structures , 2004, IEEE Transactions on Electromagnetic Compatibility.

[12]  Jong-Gwan Yook,et al.  Partial placement of electromagnetic bandgap unit cells to effectively mitigate simultaneous switching noise , 2008 .

[13]  James L. Drewniak,et al.  Power bus decoupling on multilayer printed circuit boards , 1995 .

[14]  O.M. Ramahi,et al.  Suppression of EMI and Electromagnetic Noise in Packages Using Embedded Capacitance and Miniaturized Electromagnetic Bandgap Structures With High-k Dielectrics , 2007, IEEE Transactions on Advanced Packaging.

[15]  Tzong-Lin Wu,et al.  Numerical and experimental investigation of radiation caused by the switching noise on the partitioned DC reference planes of high speed digital PCB , 2004, IEEE Transactions on Electromagnetic Compatibility.