Influence of Ag particle shape on mechanical and thermal properties of TIM joints
暂无分享,去创建一个
[1] M. Myśliwiec,et al. Pressureless Direct Bonding of Au Metallized Substrate with Si Chips by Micro-Ag Particles , 2022, Information Security Solutions Europe.
[2] H. Nishikawa,et al. The influence of porosity and pore shape on the thermal conductivity of silver sintered joint for die attach , 2021, Materials Today Communications.
[3] K. S. Siow,et al. Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints , 2021 .
[4] K. Suganuma,et al. Online Thermal Resistance and Reliability Characteristic Monitoring of Power Modules With Ag Sinter Joining and Pb, Pb-Free Solders During Power Cycling Test by SiC TEG Chip , 2021, IEEE Transactions on Power Electronics.
[5] Marty Lorgino D. Pulutan,et al. Thermomechanical Stress and Strain Distribution and Thermal Resistivity Correlation to Bondline Thickness of Ag Sinter , 2020, 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
[6] K. Suganuma,et al. Evaluation of high temperature reliability of SiC die attached structure with sinter micron-size Ag particles paste on Ni-P/Pd/Au plated substrates , 2020, 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
[7] C. Qian,et al. Experimental Investigation on the Sintering Kinetics of Nanosilver Particles Used in High-Power Electronic Packaging , 2020, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[8] Zhang Ruifen,et al. The Study of Void Formation in Ag Sinter Joint , 2018, 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
[9] K. Suganuma,et al. Sintering mechanism of micron/submicron-size silver particles , 2018, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
[10] M. Burzo,et al. Investigation of pressure dependence of interface thermal resistance in thermal greases by transient thermoreflectance , 2018, 2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM).
[11] Wenzhong Zhao,et al. Overview of the assembly and packaging of wide band gap semiconductor technologies , 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).
[12] Samjid H. Mannan,et al. Review of silver nanoparticle based die attach materials for high power/temperature applications , 2017, Microelectron. Reliab..
[13] S. T. Chua,et al. Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (DBC) and copper substrates aged at 300 °C , 2016 .
[14] Josef Hansson,et al. Review of current progress of thermal interface materials for electronics thermal management applications , 2016, 2016 IEEE 16th International Conference on Nanotechnology (IEEE-NANO).
[15] Jesse Galloway,et al. Localized TIM characterization using deconstructive analysis , 2015, 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM).
[16] S. Narumanchi,et al. Thermal interface materials for power electronics applications , 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.