Elastoplastic Analysis of Surface-Mount Solder Joints

Thermal strain in surface-mount chip resistor assemblies is studied by the finite element method using two- and three-dimensional models. Emphasis is placed on the effects of interconnection geometry on solder joint fatigue. Nine different solder joint geometries are considered.

[1]  J. H. Lau,et al.  Stress and Deflection Analysis of Partially Routed Panels for Depanelization , 1987 .

[2]  J. Lau,et al.  Thermal Fatigue Reliability of SMT Packages and Interconnections , 1987, 25th International Reliability Physics Symposium.

[3]  W. Drugan,et al.  Theory of plasticity , 1987 .

[4]  H. Solomon.  Fatigue of 60/40 Solder , 1986 .

[5]  Howard H. Manko,et al.  Soldering handbook for printed circuits and surface mounting : design, materials, processes, equipment, trouble-shooting, quality, economy, and line management , 1986 .

[6]  J. Sofia,et al.  Investigation of Solder Fatigue Acceleration Factors , 1985 .

[7]  J. Lau,et al.  Deformation of curved bars with creep , 1985 .

[8]  P. Hall.  Forces, Moments, and Displacements During Thermal Chamber Cycling of Leadless Ceramic Chip Carriers Soldered to Printed Boards , 1984 .

[9]  J. Lau,et al.  Bending and Twisting of Pipes With Strain Hardening , 1984 .

[10]  J. Lau,et al.  Nonlinear Stress Analysis of Curved Bars , 1984 .

[11]  J. Lau,et al.  Creep of Thin-Walled Cylinder under Combined Loads , 1984 .

[12]  J. Lau,et al.  Creep of Thin-Walled Circular Cylinder Under Axial Force, Bending, and Twisting Moments , 1984 .

[13]  T. Dudderar,et al.  Thermal Deformations Observed in Leadless Ceramic Chip Carriers Surface Mounted to Printed Wiring Boards , 1983 .

[14]  Peter P. Silvester,et al.  Finite Elements for Electrical Engineers , 1983 .

[15]  W. Engelmaier.  Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling , 1983 .

[16]  B. F. T. Bolker,et al.  Real time sputter deposition monitoring using glow discharge mass spectroscopy , 1983 .

[17]  R. Howard,et al.  Packaging Reliability-How to Define and Measure It , 1982 .

[18]  H. Saunders,et al.  Finite element procedures in engineering analysis , 1982 .

[19]  John H. Lau,et al.  Bending and twisting of pipe with creep , 1981 .

[20]  J. Lau,et al.  Bending and Twisting of Internally Pressurized Thin-Walled Cylinder With Creep , 1981 .

[21]  J. Lau.  Bending of Circular Cylinder with Creep , 1981 .

[22]  E. Baker,et al.  Stress relaxation in Tin-Lead solders , 1979 .

[23]  J. Z. Zhu,et al.  The finite element method , 1977 .

[24]  Bela Imre Sandor,et al.  Fundamentals of cyclic stress and strain , 1972 .

[25]  S. Timoshenko,et al.  Theory of Elasticity (3rd ed.) , 1970 .

[26]  Keith C. Norris,et al.  Reliability of controlled collapse interconnections , 1969 .

[27]  Y. Fung.  Foundations of solid mechanics , 1965 .

[28]  S. Timoshenko,et al.  Theory of elasticity , 1975 .