Characterization of high-frequency plane-to-plane coupling through cutout in multi-layer packages

Today's modeling methodologies for multi-layer power distribution systems do not take into account coupling between powedground plane pairs. If power/ground planes have cutout in them, substantial coupling may occur between plane pairs through the cutout. This coupling effect may increase the simulation error when high speed system which has cutout structures in their poweriground planes is to be analyzed. This paper presents analytical model which captures coupling effect through cutout in multi-layer powedground planes. Based on the model, the suppression method is discussed. According to the simulation results, the coupling noise through cutout can be successfully suppressed by placing the ports and cutouts at the proper locatious.

[1]  Madhavan Swaminathan,et al.  Modeling of field penetration through planes in multilayered packages , 2001 .

[2]  R. Levy.  Improved Single and Multiaperature Waveguide Coupling Theory, Including Explanation of Mutual Interactions , 1980 .

[3]  Keunmyung Lee,et al.  Modeling and analysis of multichip module power supply planes , 1995 .

[4]  Nanju Na,et al.  Modeling and transient simulation of planes in electronic packages , 2000 .

[5]  Barry K. Gilbert,et al.  Wave model solution to the ground/power plane noise problem , 1995 .

[6]  Zhang Jin,et al.  Physics based modeling of simultaneous switching noise in high speed systems , 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

[7]  Seymour B. Cohn,et al.  Microwave Coupling by Large Apertures , 1952, Proceedings of the IRE.

[8]  M. K. Iyer,et al.  Investigation of plane-to-plane noise coupling through cutout in multi-layer power/ground planes , 2002, 4th Electronics Packaging Technology Conference, 2002..

[9]  Myoung Joon Choi,et al.  A quasi three-dimensional distributed electromagnetic model for complex power distribution networks , 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

[10]  Barry Kent Gilbert,et al.  High-frequency characterization of power/ground-plane structures , 1999 .

[11]  D. Pozar.  Microwave Engineering , 1990 .

[12]  Takanori Okoshi.  Planar Circuits for Microwaves and Lightwaves , 1985 .